Bengaluru : Infosys, a global leader in next generation digital services and consulting, has been selected by GLOBALFOUNDRIES (GF ), the world''s leading specialty foundry, as its partner for the company''s Digital Transformation program.Through this partnership, Infosys will provide expertise and analytical solutions to optimize the overall efficiency and agility of GF''s manufacturing and business operations.
GF aims to transform its legacy solutions and adopt advanced cloud capabilities to rationalize existing workloads, realizing GF s digital strategy through process automation while achieving lower cost of ownership and ensuring compliance requirements, said Thomas Weber, SVP Global Supply Chain and Integrated Manufacturing Information Technology, GlobalFoundries.It will also help GF derive value and insights from the data generated across its dispersed operations. GF will leverage Infosys domain expertise and industry experience to transform and optimize GF s IT assets to scale its digital capabilities.
This is a significant departure from GF;s previous statements on the topic and its own manufacturing plans. The company is also spinning off its ASIC business as a wholly owned subsidiary that will operate independently of the foundry business. GF writes:In addition, to better leverage GF s strong heritage and significant investments in ASIC design and IP, the company is establishing its ASIC business as a wholly owned subsidiary, independent from the foundry business. A relevant ASIC business requires continued access to leading edge technology. This independent ASIC entity will provide clients with access to alternative foundry options at 7nm and beyond, while allowing the ASIC business to engage with a broader set of clients, especially the growing number of systems companies that need ASIC capabilities and more manufacturing scale than GF can provide alone.
The single supplier of discrete MRAM chips, Everspin, has moved on from the in house manufacturing on wafers fabbed at Freescale to a partnership with GlobalFoundries in other to make MRAM on their 22nm FD SOI process. It has also been raising the memory capacities of their MRAM chips amp; by year 's end, we 'll be having a taste of their 256Mb amp; 1Gb chips. Though they still stand too small to be used as primary storage, the increase in MRAM memory capacities has made it alluring for use in systems with a high volume of data. It is a good step forward actually if we consider the fact that previous applications of the MRAM were only used in embedded systems to replace battery backed DRAM, small flash chips amp; SRAM buffers.
IBM, Samsung and GlobalFoundries use technology called nanosheets to make computer chip circuitry even smaller.If you're frustrated that your smartwatch isn't that smart or your phone doesn't pack enough power, IBM and Samsung have some good news for you.
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Sources familiar with the matter tell Korea&'s Electronic Times that AMD has recruited Samsung to help produce its silicon starting next year. AMD isn&'t completely ditching all of its existing manufacturing partners, however, as GlobalFoundries will stick around to help split the load. As such, Taiwan Semiconductor Manufacturing Company (TSMC) doesn&'t appear to be in AMD&'s future.Samsung and GlobalFoundries will reportedly begin mass production of AMD&'s next GPU, codenamed Greenland, in the second quarter of 2016 using a 14-nanometer FinFET LPP (Low Power Plus) manufacturing process. Production of AMD&'s Zen CPU will begin shortly after, we&'re told, and if some rumors are to be believed, 10-namometer chips could arrive as early as 2017.
Unnamed sources have informed Koreaâ€™s ET News that Samsungâ€™s foundry business has signed on to manufacture AMDâ€™s next graphics chip, code-named Greenland, starting in Q2 2016. The chip will be produced using&second-generation 14nm FinFET LPP processing, making it more power efficient and faster than the current 28nm Fiji GPU on the market. GlobalFoundries, who has licensed Samsung's 14nm FinFET technology,&will produce the Greenland GPU as well.